
Application-Solution

Ceramic is a kind of functional material with high melting point, high hardness, high wear resistance and oxidation resistance, stiffness, strength, plasticity free, high thermal stability and high chemical stability, it’s also a good insulator.
It is often used in military industry, aerospace, high-end PCB, 3C industry and so on, mainly include oxide ceramics, carbide ceramics, metal ceramics, nitride ceramics, etc., with special mechanical, optical, acoustic, electrical, magnetic, thermal and other characteristics.
Ceramic material features determines its application scope and advantage, with the development of technology, ceramic material is used more and more widely.
Raw materials production and processing technology is also getting more mature, and the ceramic laser processing become indispensable.
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The ceramic material's function and characteristics, require high precision processing, high quality, fast speed.The traditional machining is mainly CNC machining, the speed and accuracy is low, which is not suitable for high precision processing demand.So the laser cutting technology is developed for ceramic cutting, scribing, drilling.
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According to the thickness, material, processing quality and other different requirements, you can choose our equipment for drilling, cutting or blind hole and blind groove processing. Including alumina (Al2O3), aluminum nitride (AlN), zirconium oxide (ZrO2), barium titanate (BaTiO3), beryllium oxide (BeO), boron nitride (BN) and other most types of electronic ceramics, we have rich practical application experience.
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According to the thickness, material, processing quality and other different requirements, you can choose our equipment for drilling, cutting or blind hole and blind groove processing. Including alumina (Al2O3), aluminum nitride (AlN), zirconium oxide (ZrO2), barium titanate (BaTiO3), beryllium oxide (BeO), boron nitride (BN) and other most types of electronic ceramics, we have rich practical application experience.
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The advantage of picosecond laser cutting on ceramic material is mainly owe to pulse width, the instantaneous power in unit time of 1ps is very high, which can penetrate the material surface ultra-fast. Since the time is short, the contact impact on material is very small, also means that the damage is minimized and the cutting quality is best compared with other laser source, it has the ideal cutting quality, and faster cutting speed. Laser cutting ceramic is non-contact machining, no stress, small laser spot, which means high cutting precision. Compared with CNC machining, CNC has material contact on processing, more damage on material and with lower accuracy.
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● No heat affected zones and melted layers
● Grooves of less than 15 μm widths and more than 25 μm depth
● No overshooting in intersections
● Better than 0.5 μm accuracy within 40 mm area
● Fabricating up to 9 samples without any operator interference
● Controlling the fabrication process for up to 24 hours long and maintaining needed accuracy, compensating beam and mechanical drift within 0,5 μm.