In PI film etching-to-copper in particular, an imprecise cut can over-etch and damage the copper layer underneath — directly hurting yield and long-term reliability.

As modern electronics continue to demand higher power density in smaller form factors, advanced graphite films are indispensable.

Whether you are upgrading your production line to meet international UDI regulations or developing advanced microfluidic chips, picosecond and femtosecond lasers deliver the precision, durability, and biocompatibility modern medical manufacturing demands.

As the electronics industry advances toward higher frequency and greater functional integration, green picosecond lasers provide a reliable, repeatable method for processing difficult ceramic and ferrite materials.

Femtosecond (fs) laser technology—the gold standard of "cold processing"—delivers cold photoablation with pulse durations under 500fs, overcoming the melting, burrs, and heat-affected zones (HAZ) inherent to mechanical die-cutting and nanosecond/picosecond lasers.

High-speed UV and picosecond laser drilling machines have become mainstream replacements for mechanical punching in LTCC and HTCC green ceramic manufacturing.