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FPC laser cutting machine- 6555

Model: CY-CT2NZ1-6555 / CY-CT2PZ1-6555 / CY-CT2PL1-6555 / CY-CT2NL1-6555
Single Laser Head, Double Platforms
Dual Laser Heads, Dual Positioning
Dual Laser Heads, Dual Systems

Description:

Compatible with picosecond and nanosecond laser technologies.

Supports multiple laser sources: 355nm UV laser, 532nm green laser, CO₂ laser, and fiber laser.

 

Single Laser Head, Dual Platforms
Two platforms operate in a cyclic sequence with zero preparation time, maximizing processing efficiency. 

The large 650×550mm working area per platform accommodates oversized materials and supports both cover film and contour cutting applications.

 

Dual Laser Heads, Dual Positioning
Dual laser heads and platforms enable parallel processing, doubling output for identical material/contour cutting. 

Independent fiducial mark positioning ensures accuracy. 

Intelligent beam splitting from a single laser source delivers dual-beam performance with reduced maintenance requirements. 

Each platform provides a 650×550mm processing area.

 

Dual Laser Heads, Dual Systems
Dual laser heads on separate platforms work in sync, offering versatile compatibility for cutting different material types. 

With dual laser systems and dedicated operation interfaces, the dual laser sources generate parallel beams for simultaneous processing on two 650×550mm platforms, optimized for large-format materials.


Advantage:
  • Single Laser Head, Double Platforms

    Single Laser Head, Double Platforms

  • Double Laser Heads, Double Positioning

    Double Laser Heads, Double Positioning

  • Double Laser Heads, Double Systems

    Double Laser Heads, Double Systems

Structure:

6555_画板 1.jpg

Parameter:

ltem

Specification

ltem

Specification

Applicable products

CVL, FPC, RF, thin multi-layer

Wavelength

Pico UV: 355nm UV laser

Operation model

Single laser, single laser head, dual platforms

Pico green laser: 532nm green laser

Machine size

L2150*W1750*H1800mm

Cutting line width

25±5μm

(For reference only, subject to our available product)

Cutting efficiency

800mm- 7000mm/s

Machine weight

3000kg

(Depend on materials and processing requirement)     

Processing area

650*550mm *2

CCD

2 Units

Total process accuracy

± 25μm

CCD positioning accuracy

± 5μm

Repetitive positioning Accuracy of linear motor

± 2μm

Light spot size

10-25μm

Positioning accuracy of linear motor

± 3μm

Memory capacity

500G

Stitching accuracy

± 10μm

Air pressure

 0.6MPa

Splitting power accuracy

Double positioning: ±0.2W

Cooling way

Chiller

Laser power

30W

Environmental temperature

23±2°C(Non-condensing)

Galvanometer scan range

 50*50mm

Machine power

Single laser head dual platforms: 14KW/380V 50-60HZ

Laser pulse frequency

300kHz-2MHz

Double laser heads double positioning: 12KW/380V 50-60HZ

Compensate for expansion and contraction

≤1%

Double laser heads double laser systems: 16KW/380V 50-60HZ

Output pulse width

≤15ps

Laser power detection

Dynamometer


Application:

Primarily designed for FPC (flexible printed circuit) cutting, supporting cover film, contour profiling, and materials including:

FPC with 3M adhesive, FPC stiffeners, Multi-layer FPC, Multi-line profile FPC, FPC golden fingers, FPC strips, Bendable FPC, Contoured FPC, High-density FPC.

6555_画板 1 副本.jpg


 

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