Wafer Dicing:

It is a series of semiconductor manufacturing processes to form extremely small circuit structures. 

It is then cut, packaged, and tested into chips, which are widely used in various electronic devices. It is also an essential process in the semiconductor chip manufacturing process. Dividing the entire chip wafer into single chips (grains) according to the chip size is called wafer dicing.

In the wafer dicing industry, one is that traditional dicing has the following characteristics:

● Blade scribing directly acts on the surface of the wafer, causing damage inside the crystal, which can easily lead to chipping and damage to the wafer;

● The blade has a certain thickness, resulting in a larger scribing line width;

● The consumables are large and the blade needs to be replaced every half month;

● The environment is polluted, and the silicon powder water after cutting is difficult to handle