As 3C products evolve towards lighter and more integrated designs, UV picosecond laser cutting machines will expand into Mini LED and Micro OLED sectors.

Evolution of PV Cutting Technology and Bottlenecks of Traditional Processes.

As a core equipment for flexible sensor manufacturing, laser cutting machines are breaking through industrialization barriers through technological innovation.

In the era of rapid development of the Internet of Things and smart terminals, flexible sensors, as core components of human-computer interaction, are expanding at an average annual growth rate of 25%.

From 200μm dicing precision in 2000 to 1μm engineering applications in 2025, laser dicing machines have brought semiconductor processing into the nanometer era in 25 years

Combining the latest industry data and case studies, this article reveals how laser dicing machines define the future standards of semiconductor manufacturing.