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Ceramic laser cutting and drilling machine- 2020
Advantage:
1. High Quality Fiber Laser
Adopt high performance fiber laser, good laser spot quality, stable output power, long lifetime.
2. CCD Automatic Positioning
CCD automatic positioning be optional, can achieve better, higher accuracy and faster identification, and improve the production efficiency.
3. Cutting, Drilling, Scribing, All-in-one
Cutting, drilling, scribing, all-in-one, can achieve cutting variety of ceramic and metal materials.
Features:
1. High Quality CO2 Laser
Adopt high Performance CO2 laser, good laser spot quality, high cutting speed, high quality.
2. CCD Automatic Positioning
CCD automatic positioning be optional, can achieve better, higher accurate and faster identification, and improve the production efficiency.identification, and improve the production efficiency.
3. Cutting, Scribing, All-In-One
Cutting, scribing, all-in-one, can achieve cutting variety of ceramic and Non-metal materials.
Item | Specification | Item | Specification |
Applicable products | Alumina, aluminum nitride, silicon nitride, zirconium oxide ceramics and sapphire | Wavelength | 1070nm |
Operation module | Single/dual laser head, single/dual work station | Laser frequency | 1Hz-10KHz |
Machine size | L1450*W1250*1750(mm) | Laser power | 1070W |
Net weight | 3000kg | Chilling way | Water chiller |
Platform moving range | 450x350(mm) | Photoelectric conversion rate | 30% |
Maximum processing size | 200x200(mm) | Environment temperature | 23±3℃ |
Linear motor positioning accuracy | ±2μm | Environmental humidity | 40-60%RH |
Linear motor repetitive positioning accuracy | ±1μm | Compatible file format | DXF |
Z-axis repeated positioning accuracy | ±0.01mm | Input voltage | 380V 50Hz |
Minimum processing | φ0.05mm | Machine power | 8KW |
Hole taper | ≤0.01mm | Process gas pressure | 0.8-1.5MPa |
Drilling position accuracy | ± 10μm | CCD | 1~2 |
Cutting thickness | ≤1mm | CCD positioning accuracy | ± 5μm |
Z-axis travel | 100mm |
Suitable for laser cutting and scribing of <1mm thickness alumina, zirconium oxide, aluminum nitride, silicon nitride and other ceramic materials, laser micro drilling thin ceramic.
