Laser skiving (laser opening windows) on PCB circuit boards is to remove the paint layer on the wires so that the wires can be tinned.

Resin plugging (electroplating sealing) refers to filling and leveling the vias and making their surfaces completely metallized.

The traditional depaneling methods is die punching or routing, now we the laser cutting methods are more and more widly used on flex circuits material processing, how about the comparison between them?

Beyond Laser developed special laser cutting techniques for cutting thin metal foils and very fine shims or spacers of 0.005-0.05 mm thickness used for electro-optic calibration.

Domestic science and technology have progressed rapidly, and semiconductor chips have gradually been self-produced. Some areas have reached the world's advanced level.

Ultrashort pulses can process all kinds of materials without mechanical contact, and have the characteristics of high precision, repeatability and high production efficiency.