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Laser Drilling Equipment Achieve Processing Upgrades

Dec 10, 2025 Beyond Laser Industry Trends

I. Pain Points in Aluminum Sheet Processing: Why Traditional Processes Struggle to Break Through Bottlenecks

With the rapid development of new energy vehicles, 5G communications, consumer electronics, and other fields, aluminum sheet processing demands exhibit a "two-high-one-precision" trend—high-precision micro-holes (diameter < 0.1mm), high-density hole arrays (hole spacing < 0.5mm), and precise surface treatment. Data shows that the global aluminum processing market size will exceed $2 trillion by 2025, with thin plate deep processing accounting for 35%. However, traditional mechanical drilling faces three major challenges when dealing with aluminum foil below 0.5mm and complex hole shapes:


Efficiency Bottleneck: Processing a 0.3mm deep hole takes over 30 minutes, with a monthly production capacity of only 50,000 pieces.


Quality Defects: Burr rate reaches 15%-20%, requiring secondary manual processing.


Material Limitations: Mechanical stress causes a deformation rate of over 30% when processing aluminum foil thinner than 0.1mm.


A test by an electronic component manufacturer shows that traditional electrical discharge machining costs $0.39 per hole, while laser drilling reduces it to $0.07 or less, increasing efficiency by over 4 times.


II. How Core Technologies of Laser Drilling Equipment Achieve Processing Upgrades


1. Pulsed Laser Technology: Breaking Through Micro-hole Processing Precision Limits

High-power pulsed fiber lasers optimize 5-20ns ultra-short pulses to achieve a "cold processing" effect: when processing φ0.05mm micro-holes on 0.1mm aluminum sheets, the heat-affected zone is<10μm, and the hole wall roughness Ra≤0.8μm, completely solving the thermal deformation problem of traditional processes. The equipment's dynamic focusing system automatically adapts to aluminum sheet thicknesses from 0.05-3mm, achieving ±0.01mm hole positioning accuracy, meeting the needs of aerospace-grade precision components.


2. Intelligent Processing System: From "Manual Debugging" to "One-click Production"

The new-generation laser drilling equipment integrates AI algorithms to automatically match optimal process plans based on aluminum sheet material (pure aluminum/aluminum alloy) and processing parameters (hole diameter/depth):


Data Collection: Real-time monitoring of over 20 parameters such as laser energy, processing speed, and air-blowing pressure.


Intelligent Optimization: Continuous iteration of processing paths through machine learning, reducing empty cutting time by over 30%.


Remote Management: Supports real-time monitoring via PC/mobile, increasing equipment OEE (Overall Equipment Effectiveness) to over 85%.


3. Green Manufacturing Advantages: Aligning with Global Environmental Trends

Laser drilling eliminates tool consumption, with an aluminum chip recovery rate of over 90%. Compared with traditional mechanical processing, energy consumption is reduced by 40%, and there is no cutting fluid pollution, fully complying with EU RoHS and China's [Green Development Specifications for the Aluminum Industry]. In recycled aluminum processing scenarios, the equipment directly handles surface oxide layers, increasing material utilization from 75% to 88%.



  • What are the precautions for operating a laser marking machine?

    1. It is strictly prohibited to start the laser power supply and Q-switching power supply when there is no water or the water circulation is abnormal.


    2. The Q power supply is not allowed to operate without load (i.e., the output terminal of the Q power supply should be left floating).


    3. In case of any abnormal phenomenon, first turn off the galvanometer switch and the key switch, and then conduct a check.


    4. It is not allowed to start other components before the krypton lamp is lit to prevent high voltage from entering and damaging the components.


    5. Pay attention to leaving the output terminal (anode) of the laser power supply suspended to prevent sparking and breakdown with other electrical appliances.


    6. Keep the internal circulating water clean. Regularly clean the water tank and replace it with clean deionized water or pure water.


  • What should we do when laser intensity decreases and the marking is not clear enough?

    1. Turn off the machine and check if the laser resonant cavity has changed; Fine-tune the resonant cavity lens. Make the output light spot the best;


    2. The acousto-optic crystal is offset or the output energy of the acousto-optic power supply is too low;

    Adjust the position of the audio-visual crystal or increase the working current of the audio-visual power supply;


    3. The laser entering the galvanometer deviates from the center: Adjust the laser;


    4. If the current is adjusted to around 20A but the light sensitivity is still insufficient: the krypton lamp is aging. Replace it with a new one.


  • How to maintain a UV laser cutting machine?

    1. It is required to carry out regular cleaning every day, remove debris from the countertop, limiters and guide rails, and spray lubricating oil on the guide rails


    2. The waste materials in the collection box should be cleared regularly to prevent excessive waste from blocking the exhaust port.


    3. Clean the chiller once every 15 days, drain all the internal water, and then fill it with fresh pure water.


    4. The reflector and focusing lens should be wiped with a special cleaning solution every 6 to 8 hours. 

    When wiping, use a cotton swab or cotton swab dipped in the cleaning solution to wipe from the center to the edge of the focusing lens in a counterclockwise direction. 

    At the same time, be careful not to scratch the lens.


    5. The indoor environment can affect the lifespan of the machine, especially in damp and dusty conditions. 

    A damp environment is prone to causing rust on the reflective lenses and also easily leading to short circuits, discharge and sparking of the velvet laser.


  • What accidents might be caused by the laser emission when using a laser cutting machine?

    (1) A fire was caused by the laser coming into contact with flammable materials. 

    Everyone knows that the power of laser generators is very high, especially when it comes to high-power laser cutting machines, the temperature of the emitted laser is extremely high. The possibility of a fire being caused when a laser beam comes into contact with flammable objects is very high.

    (2) Harmful gases may be produced when the machine is in operation. 

    For instance, when cutting with oxygen, it undergoes a chemical reaction with the cutting material, generating unknown chemical substances or fine particles and other impurities. After being absorbed by the human body, it may cause allergic reactions or discomfort in the lungs and other respiratory tracts. Protective measures should be taken when conducting work.

    (3) Direct laser exposure to the human body can be harmful. 

    The damage caused by lasers to the human body mainly includes damage to the eyes and skin. Among the harms caused by lasers, the damage to the eyes is the most severe. Moreover, damage to the eyes is permanent. So when doing homework, you must pay attention to protecting your eyes.


  • What is the focused spot diameter of nanosecond, picosecond and femtosecond laser?

    Nanosecond: The light spot is 0.5-1mm.

    Picosecond: The focused spot is around 0.02mm.

    Femtosecond: Under the action of a laser beam with a high repetition rate of 100-200KHz and a very short pulse width of 10ps,

    the focused spot diameter is as small as 0.003mm.


  • What are the main applications of UV laser cutting machine?

    The UV laser cutting machine can be used for cutting and depaneling PCB. 

    It can precisely cut and shape various types of PCB circuit boards with V-CUT and stamp holes, and open Windows and covers. 

    It can also be used for separating packaged circuit boards and ordinary smooth boards. 

    It is suitable for cutting various types of PCB substrates, such as ceramic substrates, rigid-flex boards, FR4, PCBs, FPCs, fingerprint recognition modules, cover films, composite materials, copper substrates, aluminum substrates, etc.

  • Precautions for laser cutting machines to process various metal materials?

    Copper and brass: 

    Both materials have high reflectivity and excellent thermal conductivity. 

    Brass with a thickness of less than 1mm can be processed by nitrogen laser cutting. 

    Copper with a thickness of less than 2mm can be cut. The gas used for laser cutting processing must be oxygen. 

    Copper and brass can only be cut when a "reflective absorption" device is installed on the system. Otherwise, reflection will damage the optical components.


    Synthetic materials: 

    Processable synthetic materials include: thermoplastics, thermosetting materials and artificial rubber.


    Aluminum: 

    Despite its high reflectivity and thermal conductivity, aluminum materials with a thickness of less than 6mm can be cut, depending on the type of alloy and the capacity of the laser. 

    When cutting with oxygen, the cutting surface is rough and hard. 

    When nitrogen is used, the cutting surface is smooth. 

    Pure aluminum is extremely difficult to cut due to its high purity. 

    Only when a "reflection and absorption" device is installed on the fiber laser cutting machine system can aluminum materials be cut. 

    Otherwise, reflection will damage the optical components


  • What should be paid attention to when laser cutting stainless steel?

    Laser cutting processing of stainless steel requires the use of oxygen, under the condition that edge oxidation is not a concern. 

    If nitrogen is used to achieve an edge free of oxidation and burrs, no further processing is required. 

    Coating an oil film on the surface of the sheet will achieve a better perforation effect without reducing the processing quality.

 

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