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Ultraviolet Picosecond Laser Cutting Empowering Precision Medicine with a "Cold Light Blade"
1. Overview of Ultraviolet Picosecond Laser Cutting Technology and Its Core Advantages
Currently, medical technology is developing rapidly towards minimally invasive, personalized, and precise directions, placing increasingly stringent requirements on the precision, safety, and biocompatibility of processing technologies in medical device manufacturing. Traditional processing technologies generally have the pain point of being difficult to balance precision control and material damage. However, ultraviolet picosecond laser cutting machines, relying on three core advantages—ultra-short pulse duration at the picosecond level (10⁻¹²s), high photon energy in the ultraviolet band, and an extremely small heat-affected zone—have become key core equipment to solve this industry problem. Ultraviolet picosecond laser cutting technology accurately matches the core demand for high-precision and low-damage processing in the medical field, bringing a revolutionary breakthrough to medical device manufacturing. It demonstrates irreplaceable application value in key scenarios such as microfabrication of implantable devices and precision forming of medical consumables, helping to promote the upgrading of the precision medical industry.
2. Application of Ultraviolet Picosecond Laser Cutting in Precision Processing of Medical Devices
2.1 Microstructural Preparation of Implantable Medical Devices
Implantable medical devices are in direct contact and integration with human tissues. Processing precision, surface microstructure, and material performance stability directly determine the therapeutic effect and patient safety. Problems such as thermal deformation, performance degradation, and surface burrs easily caused by traditional processing technologies are fatal defects in the manufacturing of implantable devices. The "cold processing" mode of ultraviolet picosecond laser cutting can minimize damage to the material matrix and accurately realize microstructural preparation, providing core guarantee for the safety and reliability of implantable medical devices.
2.1.1 Cardiovascular Stent Manufacturing
In the manufacturing of cardiovascular stents, the high-precision advantage of ultraviolet picosecond laser cutting is fully released. As a core interventional device for treating coronary heart disease, the width of the support structure of cardiovascular stents is usually only 80-150μm, and the cutting precision error needs to be controlled within ±5μm, putting extremely high requirements on processing technology. With the help of ultraviolet picosecond laser cutting technology, micron-level porous coatings or groove structures can be accurately processed on the surface of mainstream metal stents such as stainless steel and cobalt-chromium alloy, effectively improving the fit between the stent and vascular tissue and reducing the risk of postoperative thrombosis; at the same time, it realizes high-precision cutting and forming of stents to ensure uniform stent expansion. Compared with traditional laser cutting technology, the heat-affected zone of ultraviolet picosecond laser cutting is reduced by more than 90%, which can completely avoid thermal deformation and performance degradation of metal materials caused by high temperature, and significantly improve the clinical safety of cardiovascular stents.
2.1.2 Orthopedic Implant Processing
Ultraviolet picosecond laser cutting technology also promotes technological innovation in the field of orthopedic implant processing. Orthopedic implants such as artificial joints and bone screws need to have excellent osseointegration capabilities to achieve stable integration with human bones. Through ultraviolet picosecond laser cutting technology, bionic micro-nano textures can be processed on the surface of orthopedic implants to simulate the microstructure of human bones, creating a suitable environment for the adhesion, proliferation, and growth of osteocytes, significantly accelerating the osseointegration process and improving the long-term stability of implants. For ceramic-based orthopedic implants with high brittleness and processing difficulty such as alumina and zirconia, ultraviolet picosecond laser cutting technology can achieve high-precision cutting and drilling, effectively solving the industry pain point of material fragmentation easily caused by traditional processing methods, and expanding the application range of ceramic materials in the field of orthopedic implants.
2.1.3 Neural Electrode Preparation
In cutting-edge medical fields such as neural repair and brain-computer interfaces, ultraviolet picosecond laser cutting technology has become a core support for achieving technological breakthroughs. As a key component connecting the brain and external devices, neural electrodes need to undergo ultra-fine patterning cutting on flexible polymers (such as PDMS, PI) or metal films to prepare high-density neural electrode arrays. Ultraviolet picosecond laser cutting technology can accurately control the electrode spacing within 10μm, realizing the precise preparation of high-density neural electrode arrays; at the same time, it does not damage the flexibility and biocompatibility of materials during processing, laying a solid foundation for the clinical transformation of neural repair technology and the industrial development of brain-computer interfaces.
3. Application of Ultraviolet Picosecond Laser Cutting in Precision Forming of Medical Consumables
3.1 Microfluidic Chip Processing
As the core carrier of point-of-care testing (POCT) technology, the channel processing precision of microfluidic chips directly affects the accuracy and reliability of test results, requiring extremely high processing technology. With the help of ultraviolet picosecond laser cutting technology, micron-level channels, mixing chambers, and detection areas can be accurately processed on mainstream microfluidic chip substrates such as glass and polymers. The channel width can be as low as 5μm, and the processing edge has no burrs or hot-melt edges, ensuring precise control of fluid in the chip. Compared with traditional lithography technology, ultraviolet picosecond laser cutting technology does not require a mask, has a more flexible processing process, and can quickly adapt to the mass production needs of different types of microfluidic chips, providing strong support for the popularization and industrialization of POCT technology.
3.2 Medical Catheter and Needle Processing
In the processing of medical catheters and needles, ultraviolet picosecond laser cutting technology has effectively improved the clinical use experience and safety of medical consumables. For medical catheters, this technology can realize precise conical cutting of the tip and precise processing of side holes, ensuring the accuracy of catheter drug delivery or drainage to meet the needs of different clinical scenarios; for precision needles such as insulin needles and blood collection needles, through ultraviolet picosecond laser tip passivation treatment, on the premise of ensuring the sharpness and structural strength of the needle, it can significantly reduce puncture pain, improve patient treatment comfort, and help improve the medical service experience.
4. Future Prospects of Ultraviolet Picosecond Laser Cutting in the Medical Field
With the in-depth popularization of the concept of precision medicine, the demand for processing precision, biocompatibility, and personalized customization in the medical field will continue to increase, and the application prospect of ultraviolet picosecond laser cutting technology will become increasingly broad. Relying on its unique technical advantages, ultraviolet picosecond laser cutting technology is gradually reshaping the process paradigm of medical manufacturing, promoting the development of the medical device industry towards a more precise, safer, and more personalized direction. In the future, with further technological iteration and upgrading and cost optimization, ultraviolet picosecond laser cutting technology will achieve in-depth penetration in more medical sub-fields, injecting strong impetus into the arrival of the precision medicine era. As a "cold light blade" in the field of medical manufacturing, ultraviolet picosecond laser cutting technology is guarding human health and well-being with its excellent precision processing capabilities, and promoting the high-quality development of the medical industry.
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What are the precautions for operating a laser marking machine?
1. It is strictly prohibited to start the laser power supply and Q-switching power supply when there is no water or the water circulation is abnormal.
2. The Q power supply is not allowed to operate without load (i.e., the output terminal of the Q power supply should be left floating).
3. In case of any abnormal phenomenon, first turn off the galvanometer switch and the key switch, and then conduct a check.
4. It is not allowed to start other components before the krypton lamp is lit to prevent high voltage from entering and damaging the components.
5. Pay attention to leaving the output terminal (anode) of the laser power supply suspended to prevent sparking and breakdown with other electrical appliances.
6. Keep the internal circulating water clean. Regularly clean the water tank and replace it with clean deionized water or pure water.
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What should we do when laser intensity decreases and the marking is not clear enough?
1. Turn off the machine and check if the laser resonant cavity has changed; Fine-tune the resonant cavity lens. Make the output light spot the best;
2. The acousto-optic crystal is offset or the output energy of the acousto-optic power supply is too low;
Adjust the position of the audio-visual crystal or increase the working current of the audio-visual power supply;
3. The laser entering the galvanometer deviates from the center: Adjust the laser;
4. If the current is adjusted to around 20A but the light sensitivity is still insufficient: the krypton lamp is aging. Replace it with a new one.
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How to maintain a UV laser cutting machine?
1. It is required to carry out regular cleaning every day, remove debris from the countertop, limiters and guide rails, and spray lubricating oil on the guide rails
2. The waste materials in the collection box should be cleared regularly to prevent excessive waste from blocking the exhaust port.
3. Clean the chiller once every 15 days, drain all the internal water, and then fill it with fresh pure water.
4. The reflector and focusing lens should be wiped with a special cleaning solution every 6 to 8 hours.
When wiping, use a cotton swab or cotton swab dipped in the cleaning solution to wipe from the center to the edge of the focusing lens in a counterclockwise direction.
At the same time, be careful not to scratch the lens.
5. The indoor environment can affect the lifespan of the machine, especially in damp and dusty conditions.
A damp environment is prone to causing rust on the reflective lenses and also easily leading to short circuits, discharge and sparking of the velvet laser.
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What accidents might be caused by the laser emission when using a laser cutting machine?
(1) A fire was caused by the laser coming into contact with flammable materials.
Everyone knows that the power of laser generators is very high, especially when it comes to high-power laser cutting machines, the temperature of the emitted laser is extremely high. The possibility of a fire being caused when a laser beam comes into contact with flammable objects is very high.
(2) Harmful gases may be produced when the machine is in operation.
For instance, when cutting with oxygen, it undergoes a chemical reaction with the cutting material, generating unknown chemical substances or fine particles and other impurities. After being absorbed by the human body, it may cause allergic reactions or discomfort in the lungs and other respiratory tracts. Protective measures should be taken when conducting work.
(3) Direct laser exposure to the human body can be harmful.
The damage caused by lasers to the human body mainly includes damage to the eyes and skin. Among the harms caused by lasers, the damage to the eyes is the most severe. Moreover, damage to the eyes is permanent. So when doing homework, you must pay attention to protecting your eyes.
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What is the focused spot diameter of nanosecond, picosecond and femtosecond laser?
Nanosecond: The light spot is 0.5-1mm.
Picosecond: The focused spot is around 0.02mm.
Femtosecond: Under the action of a laser beam with a high repetition rate of 100-200KHz and a very short pulse width of 10ps,
the focused spot diameter is as small as 0.003mm.
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What are the main applications of UV laser cutting machine?
The UV laser cutting machine can be used for cutting and depaneling PCB.
It can precisely cut and shape various types of PCB circuit boards with V-CUT and stamp holes, and open Windows and covers.
It can also be used for separating packaged circuit boards and ordinary smooth boards.
It is suitable for cutting various types of PCB substrates, such as ceramic substrates, rigid-flex boards, FR4, PCBs, FPCs, fingerprint recognition modules, cover films, composite materials, copper substrates, aluminum substrates, etc.
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Precautions for laser cutting machines to process various metal materials?
Copper and brass:
Both materials have high reflectivity and excellent thermal conductivity.
Brass with a thickness of less than 1mm can be processed by nitrogen laser cutting.
Copper with a thickness of less than 2mm can be cut. The gas used for laser cutting processing must be oxygen.
Copper and brass can only be cut when a "reflective absorption" device is installed on the system. Otherwise, reflection will damage the optical components.
Synthetic materials:
Processable synthetic materials include: thermoplastics, thermosetting materials and artificial rubber.
Aluminum:
Despite its high reflectivity and thermal conductivity, aluminum materials with a thickness of less than 6mm can be cut, depending on the type of alloy and the capacity of the laser.
When cutting with oxygen, the cutting surface is rough and hard.
When nitrogen is used, the cutting surface is smooth.
Pure aluminum is extremely difficult to cut due to its high purity.
Only when a "reflection and absorption" device is installed on the fiber laser cutting machine system can aluminum materials be cut.
Otherwise, reflection will damage the optical components
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What should be paid attention to when laser cutting stainless steel?
Laser cutting processing of stainless steel requires the use of oxygen, under the condition that edge oxidation is not a concern.
If nitrogen is used to achieve an edge free of oxidation and burrs, no further processing is required.
Coating an oil film on the surface of the sheet will achieve a better perforation effect without reducing the processing quality.



