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Error Checking machine

Model: CY-MKPCB-7575
Laser X-marking Machine has self-developed visual software, the entire interface operation process is simple and easy to understand, and the fast reading meets the needs of the site. 1. Precise CCD Positioning 2. Self-developed Visual Software 3. Imported Water-cooled Laser

Description:

Laser X-marking Machine has self-developed visual software, the entire interface operation process is simple and easy to understand, and the fast reading meets the needs of the site. 

It uses imported water-cooled lasers, which are more stable, and high-resolution 2D code scanning can be used for real-time coding and reading for carrier board.


Advantage:


1. Precise CCD Positioning

Using imported high-definition and high-speed cameras to ensure the image acquisition effect, high-resolution 2D code scanning, real-time coding and reading, and precise positioning and processing.


2. Self-developed Visual Software

Completely independently developed, customizable operation interface, the entire interface operation process is simple and easy to understand and fast reading.


3. Imported Water-cooled Laser

The imported laser is more stable, and the optical focus can be adjusted according to different materials. The beam quality is high, the focus spot is small, the power distribution is uniform,and the thermal effect is small.


Parameter:

Item

Specification

Item

Specification

Undistorted engraving area

160×160(mm)

Camera pixel accuracy

8μm

Line width

0.040.08(mm)

Light source type

Red and blue dual-color light source

Minimum character height

0.35mm

Field of view

120mm

Printing depth

0.0050.035(mm)

Camera type

16K line scan camera

Excess thickness range

0.1-2(mm)

Photographing method

Motion photography

Laser repeatability printing accuracy

±0.005mm

Adsorption method

Vacuum adsorption + clamping

Seal array accuracy

±0.025mm

Transportation method

Linear motor X-axis / lifting Z-axis collaborative work

Laser light source

Green Laser

Fixed/working method

Top fixed/dual vision collaborative work

Environmental temperature

20℃25℃

Dust collection method

External negative pressure dust collection control

Environmental humidity

40%60%

X1, X2 travel

1160mm

Reference distance

AC380V 50Hz

X1, X2 axis maximum acceleration

1G

Power

15KW

Z1, Z2 axis lifting range

0~50mm

Compressed air

0.60.8MPa

Z1, Z2 axis repeated positioning accuracy

±10μm

Dust extraction

φ75mm interface

Environmental smoke

Class6 (ISO) above

Vibration source

VC-B




Application:

It is suitable for marking abnormal particles in finished products and carrier board in the PCB industry. A special mark is placed at a specific position of the plastic-sealed UNIT to identify the defective particles, which is convenient for subsequent classification and customer identification.

激光打X机_画板 1 副本.jpg

 

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