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Six Core Application Scenarios of laser dicing: Covering the Full Chip Manufacturing Lifecycle
1. Wafer Dicing: The Key to Yield Improvement
In 7nm-process 12-inch wafer dicing, laser dicing machines use an "edge pre-strengthening + center dicing" process:
First, 1064nm lasers create 200μm-wide modified layers on wafer edges to enhance crack resistance;
Then, 532nm green lasers perform center dicing at 800mm/s—3x faster than traditional mechanical dicing—reducing edge chipping from 15% to below 1%.
Data from a wafer foundry shows this process cuts single-wafer dicing time from 12 to 4 minutes, increasing annual output by 200,000 wafers.
2. Chip Packaging: Core Technology for High-Density Interconnection
In Flip Chip packaging, laser welding achieves precise connection of 100μm-pitch copper pillars:
Energy Control Precision: ±1% pulse energy stability ensures welding consistency for copper pillars of varying heights (50–150μm);
3D Dynamic Compensation: 5-axis systems adapt to ±50μm warpage on chip surfaces, achieving 99.99% welding yield.
This technology supports batch processing of over 20,000 bumps per chip, meeting the interconnection reliability requirements for AI chips with 1.2TB/s data transmission.
3. 3D Packaging: Breaking Through Stacking Layer Limits
For via processing in 512-layer+ 3D NAND wafers, laser dicing machines use a "deep-hole drilling + inner-wall passivation" process:
UV lasers (355nm) drill 5μm-diameter vias at 10,000 pulses/second with aspect ratios up to 30:1;
Femtosecond lasers (1030nm) trim the holes at nanometer scale, eliminating over 90% of micro-cracks to ensure structural stability in stacked packaging.
4. Optoelectronic Device Processing: Key to Mass-Producing VCSEL and DFB Chips
In VCSEL wafer dicing, laser dicing machines use a "galvanometer + field lens" combination for seamless continuous processing:
300mm wafer dicing time < 10 minutes—60% faster than stepper motor-driven equipment;
Integrated wavelength sorting systems real-time screen emitted wavelengths, boosting yield to 99.8%.
This technology has become standard for large-scale production of 400G optical modules in data centers.
5. Third-Generation Semiconductor Processing: Catalyst for Material Revolution
In 6-inch SiC wafer thinning, laser stealth dicing replaces traditional grinding:
Lasers create 100μm-deep modified layers on wafer backsides, achieving thickness uniformity within ±1μm after cleavage;
Processing speed reaches 200mm/s—5x faster than wire dicing—reducing material waste from 20% to below 3%.
A power semiconductor manufacturer using this solution saw a 15% reduction in SiC MOSFET on-resistance and 40% lower production costs.
6. R&D and Low-Volume Production: Flexible Solutions for Rapid Validation
For R&D of quantum chips and photonic integrated circuits (PICs), laser dicing machines support:
Multi-Process Integration: Single-device realization of dicing, drilling, and surface modification for rapid design validation;
Minimum Feature Size: 5μm linewidth processing capability, meeting requirements for microstructures like quantum dot arrays and optical waveguides.
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What are the precautions for operating a laser marking machine?
1. It is strictly prohibited to start the laser power supply and Q-switching power supply when there is no water or the water circulation is abnormal.
2. The Q power supply is not allowed to operate without load (i.e., the output terminal of the Q power supply should be left floating).
3. In case of any abnormal phenomenon, first turn off the galvanometer switch and the key switch, and then conduct a check.
4. It is not allowed to start other components before the krypton lamp is lit to prevent high voltage from entering and damaging the components.
5. Pay attention to leaving the output terminal (anode) of the laser power supply suspended to prevent sparking and breakdown with other electrical appliances.
6. Keep the internal circulating water clean. Regularly clean the water tank and replace it with clean deionized water or pure water.
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What should we do when laser intensity decreases and the marking is not clear enough?
1. Turn off the machine and check if the laser resonant cavity has changed; Fine-tune the resonant cavity lens. Make the output light spot the best;
2. The acousto-optic crystal is offset or the output energy of the acousto-optic power supply is too low;
Adjust the position of the audio-visual crystal or increase the working current of the audio-visual power supply;
3. The laser entering the galvanometer deviates from the center: Adjust the laser;
4. If the current is adjusted to around 20A but the light sensitivity is still insufficient: the krypton lamp is aging. Replace it with a new one.
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How to maintain a UV laser cutting machine?
1. It is required to carry out regular cleaning every day, remove debris from the countertop, limiters and guide rails, and spray lubricating oil on the guide rails
2. The waste materials in the collection box should be cleared regularly to prevent excessive waste from blocking the exhaust port.
3. Clean the chiller once every 15 days, drain all the internal water, and then fill it with fresh pure water.
4. The reflector and focusing lens should be wiped with a special cleaning solution every 6 to 8 hours.
When wiping, use a cotton swab or cotton swab dipped in the cleaning solution to wipe from the center to the edge of the focusing lens in a counterclockwise direction.
At the same time, be careful not to scratch the lens.
5. The indoor environment can affect the lifespan of the machine, especially in damp and dusty conditions.
A damp environment is prone to causing rust on the reflective lenses and also easily leading to short circuits, discharge and sparking of the velvet laser.
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What accidents might be caused by the laser emission when using a laser cutting machine?
(1) A fire was caused by the laser coming into contact with flammable materials.
Everyone knows that the power of laser generators is very high, especially when it comes to high-power laser cutting machines, the temperature of the emitted laser is extremely high. The possibility of a fire being caused when a laser beam comes into contact with flammable objects is very high.
(2) Harmful gases may be produced when the machine is in operation.
For instance, when cutting with oxygen, it undergoes a chemical reaction with the cutting material, generating unknown chemical substances or fine particles and other impurities. After being absorbed by the human body, it may cause allergic reactions or discomfort in the lungs and other respiratory tracts. Protective measures should be taken when conducting work.
(3) Direct laser exposure to the human body can be harmful.
The damage caused by lasers to the human body mainly includes damage to the eyes and skin. Among the harms caused by lasers, the damage to the eyes is the most severe. Moreover, damage to the eyes is permanent. So when doing homework, you must pay attention to protecting your eyes.
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What is the focused spot diameter of nanosecond, picosecond and femtosecond laser?
Nanosecond: The light spot is 0.5-1mm.
Picosecond: The focused spot is around 0.02mm.
Femtosecond: Under the action of a laser beam with a high repetition rate of 100-200KHz and a very short pulse width of 10ps,
the focused spot diameter is as small as 0.003mm.
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What are the main applications of UV laser cutting machine?
The UV laser cutting machine can be used for cutting and depaneling PCB.
It can precisely cut and shape various types of PCB circuit boards with V-CUT and stamp holes, and open Windows and covers.
It can also be used for separating packaged circuit boards and ordinary smooth boards.
It is suitable for cutting various types of PCB substrates, such as ceramic substrates, rigid-flex boards, FR4, PCBs, FPCs, fingerprint recognition modules, cover films, composite materials, copper substrates, aluminum substrates, etc.
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Precautions for laser cutting machines to process various metal materials?
Copper and brass:
Both materials have high reflectivity and excellent thermal conductivity.
Brass with a thickness of less than 1mm can be processed by nitrogen laser cutting.
Copper with a thickness of less than 2mm can be cut. The gas used for laser cutting processing must be oxygen.
Copper and brass can only be cut when a "reflective absorption" device is installed on the system. Otherwise, reflection will damage the optical components.
Synthetic materials:
Processable synthetic materials include: thermoplastics, thermosetting materials and artificial rubber.
Aluminum:
Despite its high reflectivity and thermal conductivity, aluminum materials with a thickness of less than 6mm can be cut, depending on the type of alloy and the capacity of the laser.
When cutting with oxygen, the cutting surface is rough and hard.
When nitrogen is used, the cutting surface is smooth.
Pure aluminum is extremely difficult to cut due to its high purity.
Only when a "reflection and absorption" device is installed on the fiber laser cutting machine system can aluminum materials be cut.
Otherwise, reflection will damage the optical components
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What should be paid attention to when laser cutting stainless steel?
Laser cutting processing of stainless steel requires the use of oxygen, under the condition that edge oxidation is not a concern.
If nitrogen is used to achieve an edge free of oxidation and burrs, no further processing is required.
Coating an oil film on the surface of the sheet will achieve a better perforation effect without reducing the processing quality.