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How High-Precision Laser Cutting Equipment is Redefining Industry Standards
In the manufacturing of electronic components, precision and efficiency are eternal pursuits. With the explosive growth of industries such as 5G communications, AI chips, and new energy vehicles, traditional cutting technologies can no longer meet demands. Laser cutting equipment, with its non-contact processing, micron-level precision, and high efficiency, has become a core tool in the electronics industry. This article explores the application scenarios, technical advantages, and industry trends of laser cutting equipment in electronic component manufacturing, helping enterprises seize future opportunities.
I. Core Application Scenarios of Laser Cutting for Electronic Components
1. PCB Board Cutting and Microhole Machining
Laser cutting equipment plays a key role in PCB board manufacturing. Traditional mechanical cutting often causes burrs and edge cracks, while laser cutting equipment uses high-energy density beams for non-contact cutting, controlling the kerf width within 0.1mm and the heat-affected zone below 0.05mm. For example, when cutting aluminum-based PCB boards that require both thermal conductivity and insulation, laser cutting equipment uses quasi-continuous fiber lasers to achieve high-speed cutting on 1-2mm thick boards while avoiding insulation layer ablation. Additionally, laser microhole technology drills vias with a diameter smaller than 50μm on PCB boards, meeting the needs of high-density interconnect (HDI) boards.
2. Semiconductor Packaging and Wafer Dicing
Semiconductor packaging requires extreme precision. Laser cutting equipment enables wafer dicing and cutting using ultraviolet or femtosecond laser technology, with kerf widths as low as 10μm and chipping controlled within 2μm. For instance, cutting the 3D complex structure of MEMS sensor chips with traditional mechanical dicing often causes stress damage, while laser cutting equipment avoids thermal stress effects on device performance through cold processing.
3. Flexible Electronics and Display Panel Processing
The rise of flexible electronic devices (e.g., OLED screens, wearables) has driven innovation in laser cutting technology. Laser cutting equipment precisely cuts flexible printed circuits (FPC), preventing material deformation from mechanical stress. For example, CO₂ lasers cut PI films with smooth edges and no carbonization, meeting the process requirements for flexible display panels.
II. Technical Advantages of Laser Cutting Equipment
1. High Precision and Stability
Laser cutting equipment achieves a positioning accuracy of ±0.01mm and repeatability of ±0.005mm. The core lies in beam quality optimization—fiber lasers with an M² factor close to 1 can focus spots as small as 10μm. When cutting 0.1mm-thick stainless steel lead frames, for example, it ensures a cut perpendicularity deviation of less than 1°, guaranteeing component welding precision.
2. Non-Contact Processing and Heat-Affected Zone Control
Laser cutting is a non-contact process, eliminating tool wear and material mechanical stress. When cutting ceramic substrates, traditional mechanical methods often cause micro-cracks, while laser cutting equipment reduces the heat-affected zone to within 10μm through pulse energy control, improving yield. Femtosecond laser technology (10⁻¹⁵-second pulse width) enables "cold cutting," avoiding material melting and thermal deformation.
3. Automation and Intelligent Integration
Modern laser cutting equipment integrates automated loading/unloading systems, visual inspection, and AI algorithms. For example, a domestic laser manufacturer’s linear rail laser cutter with a four-station rotating table achieves fully automated PCB loading/unloading and cutting, increasing productivity by 30%. AI algorithms also optimize cutting parameters in real time, such as adjusting laser power and speed based on material thickness to reduce manual intervention.
III. Comparison Between Laser Cutting Equipment and Traditional Cutting Technologies
Technical Index | Laser Cutting Equipment | Traditional Mechanical Cutting |
Cutting Precision | Micron-level (±0.005mm) | Submillimeter-level (±0.1mm) |
Material Adaptability | Metals, ceramics, glass, polymers, etc. | Mainly limited to metals |
Heat-Affected Zone | <50μm | >200μm |
Processing Speed | 10-100m/min (thin plates) | 1-5m/min |
Maintenance Cost | Low (no tool wear) | High (frequent tool replacement) |
IV. Industry Trends and Future Outlook
1. Technical Upgrades
· Femtosecond Laser Technology: Femtosecond laser cutting equipment will expand in semiconductor packaging and optical device processing, leveraging submicron precision and thermal damage-free characteristics.
· Automation Integration: Integration with industrial robots and IoT will enable "lights-out factories," such as a domestic manufacturer’s smart cutting unit for 24/7 unmanned production.
· Green Manufacturing: Low-power lasers and eco-friendly materials (e.g., lead-free solders) comply with EU RoHS standards, promoting sustainable development.
2. Market Demand Drivers
The global electronic components market is expected to exceed $600 billion by 2025, with China accounting for over 35%. Rapid growth in AI chips, new energy vehicle electronics, and 5G communication devices will drive demand for laser cutting equipment. For example, high-precision copper and aluminum busbars in new energy vehicle battery management systems (BMS) rely on laser cutting equipment as a core tool.
3. Challenges and Solutions
· Cost Control: High-power lasers (e.g., 150kW fiber lasers) remain expensive; enterprises must reduce costs through scale production and technological innovation.
· Technical Barriers: International brands still dominate high-end markets; domestic companies need to breakthrough core technologies (e.g., five-axis linkage control) to enhance competitiveness.
V. Case Studies
Case 1: Wafer Cutting for an Electronics Enterprise
Requirement: Cut 300mm silicon wafers with chipping <5μm and perpendicularity deviation <0.5°.
Solution: Ultraviolet laser cutting equipment with visual positioning achieved a cutting speed of 20mm/s and a yield of 99.5%.
Benefits: 40% higher productivity, 30% lower material waste.
Case 2: Flexible Circuit Board Cutting for a Consumer Electronics Manufacturer
Requirement: Cut 0.05mm-thick PI film with no carbonization or mechanical deformation.
Solution: CO₂ laser cutting equipment with nitrogen assist gas achieved a speed of 50m/min and edge roughness Ra≤0.1μm.
Benefits: Replaced stamping, reducing costs by 50%.
Conclusion
Laser cutting equipment has become core technology in electronic component manufacturing, driving industry transformation toward intelligence and green manufacturing through high precision, efficiency, and automation. With future breakthroughs in femtosecond lasers and AI integration, it will play a key role in emerging fields like 6G and quantum computing. Enterprises must follow technological trends, optimize equipment selection, and refine processes to meet market competition and evolving demands.
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What are the precautions for operating a laser marking machine?
1. It is strictly prohibited to start the laser power supply and Q-switching power supply when there is no water or the water circulation is abnormal.
2. The Q power supply is not allowed to operate without load (i.e., the output terminal of the Q power supply should be left floating).
3. In case of any abnormal phenomenon, first turn off the galvanometer switch and the key switch, and then conduct a check.
4. It is not allowed to start other components before the krypton lamp is lit to prevent high voltage from entering and damaging the components.
5. Pay attention to leaving the output terminal (anode) of the laser power supply suspended to prevent sparking and breakdown with other electrical appliances.
6. Keep the internal circulating water clean. Regularly clean the water tank and replace it with clean deionized water or pure water.
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What should we do when laser intensity decreases and the marking is not clear enough?
1. Turn off the machine and check if the laser resonant cavity has changed; Fine-tune the resonant cavity lens. Make the output light spot the best;
2. The acousto-optic crystal is offset or the output energy of the acousto-optic power supply is too low;
Adjust the position of the audio-visual crystal or increase the working current of the audio-visual power supply;
3. The laser entering the galvanometer deviates from the center: Adjust the laser;
4. If the current is adjusted to around 20A but the light sensitivity is still insufficient: the krypton lamp is aging. Replace it with a new one.
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How to maintain a UV laser cutting machine?
1. It is required to carry out regular cleaning every day, remove debris from the countertop, limiters and guide rails, and spray lubricating oil on the guide rails
2. The waste materials in the collection box should be cleared regularly to prevent excessive waste from blocking the exhaust port.
3. Clean the chiller once every 15 days, drain all the internal water, and then fill it with fresh pure water.
4. The reflector and focusing lens should be wiped with a special cleaning solution every 6 to 8 hours.
When wiping, use a cotton swab or cotton swab dipped in the cleaning solution to wipe from the center to the edge of the focusing lens in a counterclockwise direction.
At the same time, be careful not to scratch the lens.
5. The indoor environment can affect the lifespan of the machine, especially in damp and dusty conditions.
A damp environment is prone to causing rust on the reflective lenses and also easily leading to short circuits, discharge and sparking of the velvet laser.
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What accidents might be caused by the laser emission when using a laser cutting machine?
(1) A fire was caused by the laser coming into contact with flammable materials.
Everyone knows that the power of laser generators is very high, especially when it comes to high-power laser cutting machines, the temperature of the emitted laser is extremely high. The possibility of a fire being caused when a laser beam comes into contact with flammable objects is very high.
(2) Harmful gases may be produced when the machine is in operation.
For instance, when cutting with oxygen, it undergoes a chemical reaction with the cutting material, generating unknown chemical substances or fine particles and other impurities. After being absorbed by the human body, it may cause allergic reactions or discomfort in the lungs and other respiratory tracts. Protective measures should be taken when conducting work.
(3) Direct laser exposure to the human body can be harmful.
The damage caused by lasers to the human body mainly includes damage to the eyes and skin. Among the harms caused by lasers, the damage to the eyes is the most severe. Moreover, damage to the eyes is permanent. So when doing homework, you must pay attention to protecting your eyes.
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What is the focused spot diameter of nanosecond, picosecond and femtosecond laser?
Nanosecond: The light spot is 0.5-1mm.
Picosecond: The focused spot is around 0.02mm.
Femtosecond: Under the action of a laser beam with a high repetition rate of 100-200KHz and a very short pulse width of 10ps,
the focused spot diameter is as small as 0.003mm.
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What are the main applications of UV laser cutting machine?
The UV laser cutting machine can be used for cutting and depaneling PCB.
It can precisely cut and shape various types of PCB circuit boards with V-CUT and stamp holes, and open Windows and covers.
It can also be used for separating packaged circuit boards and ordinary smooth boards.
It is suitable for cutting various types of PCB substrates, such as ceramic substrates, rigid-flex boards, FR4, PCBs, FPCs, fingerprint recognition modules, cover films, composite materials, copper substrates, aluminum substrates, etc.
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Precautions for laser cutting machines to process various metal materials?
Copper and brass:
Both materials have high reflectivity and excellent thermal conductivity.
Brass with a thickness of less than 1mm can be processed by nitrogen laser cutting.
Copper with a thickness of less than 2mm can be cut. The gas used for laser cutting processing must be oxygen.
Copper and brass can only be cut when a "reflective absorption" device is installed on the system. Otherwise, reflection will damage the optical components.
Synthetic materials:
Processable synthetic materials include: thermoplastics, thermosetting materials and artificial rubber.
Aluminum:
Despite its high reflectivity and thermal conductivity, aluminum materials with a thickness of less than 6mm can be cut, depending on the type of alloy and the capacity of the laser.
When cutting with oxygen, the cutting surface is rough and hard.
When nitrogen is used, the cutting surface is smooth.
Pure aluminum is extremely difficult to cut due to its high purity.
Only when a "reflection and absorption" device is installed on the fiber laser cutting machine system can aluminum materials be cut.
Otherwise, reflection will damage the optical components
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What should be paid attention to when laser cutting stainless steel?
Laser cutting processing of stainless steel requires the use of oxygen, under the condition that edge oxidation is not a concern.
If nitrogen is used to achieve an edge free of oxidation and burrs, no further processing is required.
Coating an oil film on the surface of the sheet will achieve a better perforation effect without reducing the processing quality.