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Code for Cost Reduction and Efficiency Improvement from Automotive Batteries to Satellite Components

Dec 02, 2025 Beyond Laser Industry Trends

I. Opening Pain Points: Three Fatal Flaws of Traditional Processing

In a quality accident at an electronics factory, 2,000 pieces of 0.2mm-thick aluminum alloy PCB substrates were scrapped due to hole position deviation from mechanical drilling, resulting in losses exceeding RMB 500,000—this exposes the inherent defects of traditional processing in thin plates:

① stress deformation from contact processing,

② poor hole diameter consistency,

③ lack of complex hole processing capability.

Laser drilling machines offer a systematic solution to these challenges.


II. Automotive Manufacturing: Value Reconstruction from "Functional" to "High-Efficiency"

1. Battery Electrodes: Micro-Hole Processing Triggered Energy Density Revolution

Test data from a leading battery manufacturer shows that in processing 18650 battery aluminum foil electrodes, a laser drilling machine uses spiral scanning path planning to compress single-hole processing time to 6ms—4 times faster than traditional equipment. More crucially, the uniform distribution of 50μm micropores reduces electrolyte penetration resistance by 22%, shortening the battery fast-charging time from 0-80% from 1.5 hours to 50 minutes.

2. Body Structural Components: Redefining the "Lightweight + High-Strength" Balance

A new energy vehicle manufacturer processed dense φ3mm weight-reducing holes (hole spacing 5mm) on aluminum alloy battery trays using a 100W fiber laser drilling machine, with a single tray processing time of only 3 minutes—5 times faster than electric discharge machining. CAE analysis shows that the structural component strength retention rate reaches 98%, but the weight is reduced by 15%, equivalent to increasing vehicle range by 8km.

3. Process Comparison: Hidden Costs as the "Killer Advantage"

Cost Item

Mechanical Drilling (Monthly Average)

Laser Drilling (Monthly Average)

Difference

Drill Bit Wear

RMB 12,000

RMB 2,000

-RMB 10,000

Deburring Labor

RMB 8,000

RMB 0

-RMB 8,000

Defective Product Loss

RMB 8,000

RMB 3,000

-RMB 12,000

Total Monthly Savings

-

-

RMB 30,000


III. Aerospace: "Millimeter-Level Survival Rules" in Extreme Conditions

1. Turbine Blade Cooling Holes: Challenging High-Temperature and Precision Limits

In processing aerospace engine blades, a femtosecond laser drilling machine uses ultra-short pulse energy control (pulse width 500fs) to achieve 100μm-diameter deep holes (depth-diameter ratio 10:1) in nickel-based superalloys, with hole wall roughness Ra≤0.6μm—3 grades higher than electric discharge machining. This technology increases blade cooling efficiency by 18% at 1200℃ and extends engine life by 2000 hours.

2. Satellite Structural Components: From "Micron-Level" to "Nanometer-Level" Precision Leap

A space research institution processed 0.2mm-thick aluminum-lithium alloy honeycomb panels using an ultraviolet laser drilling machine with a CCD visual positioning system, achieving ±5μm hole position precision—equivalent to drilling 10,000 holes on an A4 paper with a deviation of less than a human hair (75μm). This precision ensures the tight fit of satellite solar panels, preventing stress cracking under extreme space temperature differences (-200℃~150℃).


IV. 3C Electronics: "Delicacy" Processing Revolution Behind Consumer Upgrades

1. Mobile Phone Frames: From "Functional" to "Aesthetics as Justice"

A high-end mobile phone brand's titanium-aluminum alloy frame heat dissipation holes were processed with a 355nm-wavelength ultraviolet laser drilling machine to achieve 0.2mm-diameter holes with no carbonization or burrs at the edges. Combined with subsequent anodizing, the hole edge gloss consistency with the body reaches 99%. This "invisible processing" technology turns precision holes into part of the industrial design rather than defects.

2. PCB Boards: The "Game-Changer" for HDI Board Micro-Hole Processing

In the production of high-order HDI boards by a circuit board manufacturer, a CO₂ laser drilling machine achieved batch processing of 50μm blind holes with a hole bottom copper foil damage rate<0.5%—10 times higher yield than traditional mechanical drilling. This technology supports more than 10 layers of high-density circuit boards, providing key support for the miniaturization of 5G mobile phones.


V. Selection Practices: "Optimal Solution" Formulas for Different Scenarios

1. Material Thickness Matching Table

Plate Thickness (mm)

Recommended Laser Type

Power Range

Hole Diameter Range

Typical Applications

0.05-0.3

Ultraviolet/Femtosecond Lasers

20-50W

20-100μm

Phone frames, electrodes

0.3-1.0

Pulsed Fiber Lasers

50-150W

50-500μm

Automotive structural components, PCBs

1.0-2.5

High-Power Fiber Lasers

150-500W

200-2000μm

Aerospace components

2. Production Capacity Calculation Formula

Daily Production Capacity (holes) = Working Time (8h) × 3600s × Processing Speed (holes/s) × Equipment Utilization Rate (85%)
Example: Choosing a 100 holes/s device, daily capacity ≈ 2.6 million holes.


3. Investment Return Quick Calculation Table

Industry

Single Hole Cost (Mechanical)

Single Hole Cost (Laser)

Annual Processing Volume

Annual Cost Savings

Automotive Parts

RMB 0.08

RMB 0.03

50 million holes

RMB 2.5 million

Electronic Components

RMB 0.15

RMB 0.06

30 million holes

RMB 2.7 million

 

VI. The Future is Here: Three Evolution Directions of Laser Drilling Machines

1. Full-Link Intelligence

Some new-model laser drilling machines are equipped with IoT systems that can real-time collect over 200 processing parameters, achieving predictive maintenance through cloud AI analysis and reducing equipment downtime by 40%.

2. Material Compatibility Breakthrough

Laser drilling technology for CFRP/Al laminated materials has entered mass production. Through pulse energy gradient control, it solves the delamination problem of carbon fiber layers, with processing efficiency 3 times that of traditional processes.

3. Green Manufacturing Upgrade

Laser drilling machines using energy recovery technology have standby power reduced to 30W, equipped with integrated dust purification devices, meeting international environmental certification requirements.

VII. Conclusion

As "precision" becomes the core competitiveness of manufacturing, laser drilling machines are no longer just processing equipment but strategic tools for enterprises to break through production ceilings and capture high-end markets. Whether for automotive production lines pursuing extreme efficiency or aerospace manufacturing demanding zero defects, choosing the right laser drilling machine solution (equipment selection + process optimization + intelligent upgrading) is becoming a key step in determining an enterprise's competitiveness for the next five years.


 


  • What are the precautions for operating a laser marking machine?

    1. It is strictly prohibited to start the laser power supply and Q-switching power supply when there is no water or the water circulation is abnormal.


    2. The Q power supply is not allowed to operate without load (i.e., the output terminal of the Q power supply should be left floating).


    3. In case of any abnormal phenomenon, first turn off the galvanometer switch and the key switch, and then conduct a check.


    4. It is not allowed to start other components before the krypton lamp is lit to prevent high voltage from entering and damaging the components.


    5. Pay attention to leaving the output terminal (anode) of the laser power supply suspended to prevent sparking and breakdown with other electrical appliances.


    6. Keep the internal circulating water clean. Regularly clean the water tank and replace it with clean deionized water or pure water.


  • What should we do when laser intensity decreases and the marking is not clear enough?

    1. Turn off the machine and check if the laser resonant cavity has changed; Fine-tune the resonant cavity lens. Make the output light spot the best;


    2. The acousto-optic crystal is offset or the output energy of the acousto-optic power supply is too low;

    Adjust the position of the audio-visual crystal or increase the working current of the audio-visual power supply;


    3. The laser entering the galvanometer deviates from the center: Adjust the laser;


    4. If the current is adjusted to around 20A but the light sensitivity is still insufficient: the krypton lamp is aging. Replace it with a new one.


  • How to maintain a UV laser cutting machine?

    1. It is required to carry out regular cleaning every day, remove debris from the countertop, limiters and guide rails, and spray lubricating oil on the guide rails


    2. The waste materials in the collection box should be cleared regularly to prevent excessive waste from blocking the exhaust port.


    3. Clean the chiller once every 15 days, drain all the internal water, and then fill it with fresh pure water.


    4. The reflector and focusing lens should be wiped with a special cleaning solution every 6 to 8 hours. 

    When wiping, use a cotton swab or cotton swab dipped in the cleaning solution to wipe from the center to the edge of the focusing lens in a counterclockwise direction. 

    At the same time, be careful not to scratch the lens.


    5. The indoor environment can affect the lifespan of the machine, especially in damp and dusty conditions. 

    A damp environment is prone to causing rust on the reflective lenses and also easily leading to short circuits, discharge and sparking of the velvet laser.


  • What accidents might be caused by the laser emission when using a laser cutting machine?

    (1) A fire was caused by the laser coming into contact with flammable materials. 

    Everyone knows that the power of laser generators is very high, especially when it comes to high-power laser cutting machines, the temperature of the emitted laser is extremely high. The possibility of a fire being caused when a laser beam comes into contact with flammable objects is very high.

    (2) Harmful gases may be produced when the machine is in operation. 

    For instance, when cutting with oxygen, it undergoes a chemical reaction with the cutting material, generating unknown chemical substances or fine particles and other impurities. After being absorbed by the human body, it may cause allergic reactions or discomfort in the lungs and other respiratory tracts. Protective measures should be taken when conducting work.

    (3) Direct laser exposure to the human body can be harmful. 

    The damage caused by lasers to the human body mainly includes damage to the eyes and skin. Among the harms caused by lasers, the damage to the eyes is the most severe. Moreover, damage to the eyes is permanent. So when doing homework, you must pay attention to protecting your eyes.


  • What is the focused spot diameter of nanosecond, picosecond and femtosecond laser?

    Nanosecond: The light spot is 0.5-1mm.

    Picosecond: The focused spot is around 0.02mm.

    Femtosecond: Under the action of a laser beam with a high repetition rate of 100-200KHz and a very short pulse width of 10ps,

    the focused spot diameter is as small as 0.003mm.


  • What are the main applications of UV laser cutting machine?

    The UV laser cutting machine can be used for cutting and depaneling PCB. 

    It can precisely cut and shape various types of PCB circuit boards with V-CUT and stamp holes, and open Windows and covers. 

    It can also be used for separating packaged circuit boards and ordinary smooth boards. 

    It is suitable for cutting various types of PCB substrates, such as ceramic substrates, rigid-flex boards, FR4, PCBs, FPCs, fingerprint recognition modules, cover films, composite materials, copper substrates, aluminum substrates, etc.

  • Precautions for laser cutting machines to process various metal materials?

    Copper and brass: 

    Both materials have high reflectivity and excellent thermal conductivity. 

    Brass with a thickness of less than 1mm can be processed by nitrogen laser cutting. 

    Copper with a thickness of less than 2mm can be cut. The gas used for laser cutting processing must be oxygen. 

    Copper and brass can only be cut when a "reflective absorption" device is installed on the system. Otherwise, reflection will damage the optical components.


    Synthetic materials: 

    Processable synthetic materials include: thermoplastics, thermosetting materials and artificial rubber.


    Aluminum: 

    Despite its high reflectivity and thermal conductivity, aluminum materials with a thickness of less than 6mm can be cut, depending on the type of alloy and the capacity of the laser. 

    When cutting with oxygen, the cutting surface is rough and hard. 

    When nitrogen is used, the cutting surface is smooth. 

    Pure aluminum is extremely difficult to cut due to its high purity. 

    Only when a "reflection and absorption" device is installed on the fiber laser cutting machine system can aluminum materials be cut. 

    Otherwise, reflection will damage the optical components


  • What should be paid attention to when laser cutting stainless steel?

    Laser cutting processing of stainless steel requires the use of oxygen, under the condition that edge oxidation is not a concern. 

    If nitrogen is used to achieve an edge free of oxidation and burrs, no further processing is required. 

    Coating an oil film on the surface of the sheet will achieve a better perforation effect without reducing the processing quality.

 

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