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The Future of Medical Diagnostics: High-End Laser Cutting Applications in Electrode Chip Manufacturing

Jan 21, 2026 Beyond Laser Industry Trends

In the rapidly evolving landscape of biotechnology, the demand for precision has never been higher. As we move further into an era of personalized medicine and rapid diagnostics, the electrode chip has emerged as a cornerstone technology. However, the manufacturing of these components requires a level of delicacy and accuracy that traditional methods often fail to provide. Beyond Laser, a leader in laser industrialization, has introduced specialized laser cutting solutions that address these high-end requirements..


Understanding Electrode Chips: The Heart of Modern Biosensing


Electrode chips represent a significant leap in miniaturized technology. To understand why their manufacturing is so critical, one must first look at their composition and utility.


What is an Electrode Chip?


An electrode chip is defined as a miniaturized electrochemical component. These chips are engineered to facilitate the interaction between electronic systems and biological samples. Their primary characteristics include:

  • High Conductivity: Essential for transmitting sensitive electrochemical signals without data loss.

  • Biocompatibility: They must be able to interact with biological tissues or fluids without causing adverse reactions, which is vital for medical applications.

  • High Sensitivity: They are capable of detecting minute changes in chemical or biological environments.


Key Applications in Healthcare and Research


Because of their unique properties, electrode chips are widely utilized in several high-stakes fields:

  1. Drug Screening: Used to test the efficacy and toxicity of new pharmaceutical compounds at a cellular level.

  2. Virus Detection: Critical for rapid diagnostic tools that identify viral pathogens with high precision.

  3. Biomolecule Detection: Employed in identifying proteins, DNA, and other vital markers in biological research.


Technical Challenges in Traditional Electrode Chip Processing

While electrode chips offer immense potential, they are notoriously difficult to manufacture. According to industry insights from Beyond Laser (published September 21, 2024), several hurdles persist in the preparation of these components.


High Preparation and Testing Costs

The technology required to prepare and test these chips is inherently expensive. Traditional methods often involve complex clean-room environments and specialized chemical etching processes that can drive up the per-unit cost.


Stability and Processing Requirements

Electrode chips often suffer from poor stability if not handled correctly during the fabrication phase. They have extremely high processing requirements because even the slightest deviation in the cutting or shaping of the chip can compromise its electrochemical performance.

Traditional mechanical cutting methods frequently introduce:

  • Physical stress on the delicate substrates.

  • Dust and debris that contaminate the conductive paths.

  • Burrs that interfere with the miniaturized circuitry.


How Laser Cutting Technology Revolutionizes Chip Production


Laser technology has provided a definitive solution for the challenges associated with "medical chips". By moving away from physical blades and toward light-based precision, manufacturers can achieve results that were previously impossible.


Achieving the "Zero-Defect" Standard

The advantages of using laser cutting machines for electrode chips are numerous and directly address the stability issues mentioned earlier:

  • Zero Carbonization: Unlike older laser systems, modern high-end machines ensure no carbon buildup on the edges, which is crucial for maintaining the purity of the electrochemical signal.

  • No Burrs: The laser produces a clean cut, eliminating the need for secondary polishing or cleaning.

  • Small Heat-Affected Zone (HAZ): By concentrating energy into a tiny area, the laser prevents heat-induced damage to the surrounding biocompatible materials.


Precision and Surface Integrity

Compared to traditional cutting processes, the laser method offers a "stress-free" environment. This is vital for electrode chips, which are often made of thin, fragile materials.


  • Dust-Free Processing: The non-contact nature of the laser ensures that no physical debris is generated during the cut.

  • Smooth and Neat Edges: The cutting edges are remarkably smooth, ensuring that the chip fits perfectly into its intended housing or diagnostic device.

  • No Surface Damage: The laser does not damage the material surface, preserving the integrity of the conductive layers.


Economic and Industrial Efficiency of Laser Systems

Beyond just the quality of the cut, laser cutting machines offer significant operational advantages for high-tech enterprises.

Feature

Advantage for Manufacturers

Fast Cutting Speed

Increases throughput and reduces the time-to-market for new chips.


Dual Tabletop Processing

Allows for simultaneous processing, effectively doubling production capacity.


No Mold Opening Required

Eliminates the need for expensive custom molds, making it ideal for prototyping and small-batch production.


Labor-Saving

High levels of automation reduce the need for constant manual intervention.


By being economical, time-saving, and labor-saving, laser technology lowers the entry barrier for high-sensitivity chip production.


Beyond Laser: Leading the Charge in Laser Industrialization

The advancement of this technology is driven by companies like Beyond Laser, which has established itself as a national leader in laser industrialization applications in China.


A Legacy of Innovation


Based in the high-tech hub of Shenzhen, Beyond Laser has spent more than ten years refining its approach to precision manufacturing. The company focuses on:


  • Independent Innovation: Constantly improving product precision and technical processes.

  • Industry Alignment: Keeping pace with the rapid technological development of the medical and research industries.

  • High-Quality Service: Providing tailored solutions for medical research and other high-tech fields.


Conclusion

The integration of laser cutting machines into the production of electrode chips represents a major milestone in medical manufacturing. 

By overcoming the limitations of traditional cutting—such as burrs, dust, and thermal damage—laser technology ensures that these high-sensitivity components can be produced reliably and economically. .

As companies like Beyond Laser continue to innovate, the potential for even smaller, more sensitive, and more stable electrode chips will only continue to grow.



  • What are the precautions for operating a laser marking machine?

    1. It is strictly prohibited to start the laser power supply and Q-switching power supply when there is no water or the water circulation is abnormal.


    2. The Q power supply is not allowed to operate without load (i.e., the output terminal of the Q power supply should be left floating).


    3. In case of any abnormal phenomenon, first turn off the galvanometer switch and the key switch, and then conduct a check.


    4. It is not allowed to start other components before the krypton lamp is lit to prevent high voltage from entering and damaging the components.


    5. Pay attention to leaving the output terminal (anode) of the laser power supply suspended to prevent sparking and breakdown with other electrical appliances.


    6. Keep the internal circulating water clean. Regularly clean the water tank and replace it with clean deionized water or pure water.


  • What should we do when laser intensity decreases and the marking is not clear enough?

    1. Turn off the machine and check if the laser resonant cavity has changed; Fine-tune the resonant cavity lens. Make the output light spot the best;


    2. The acousto-optic crystal is offset or the output energy of the acousto-optic power supply is too low;

    Adjust the position of the audio-visual crystal or increase the working current of the audio-visual power supply;


    3. The laser entering the galvanometer deviates from the center: Adjust the laser;


    4. If the current is adjusted to around 20A but the light sensitivity is still insufficient: the krypton lamp is aging. Replace it with a new one.


  • How to maintain a UV laser cutting machine?

    1. It is required to carry out regular cleaning every day, remove debris from the countertop, limiters and guide rails, and spray lubricating oil on the guide rails


    2. The waste materials in the collection box should be cleared regularly to prevent excessive waste from blocking the exhaust port.


    3. Clean the chiller once every 15 days, drain all the internal water, and then fill it with fresh pure water.


    4. The reflector and focusing lens should be wiped with a special cleaning solution every 6 to 8 hours. 

    When wiping, use a cotton swab or cotton swab dipped in the cleaning solution to wipe from the center to the edge of the focusing lens in a counterclockwise direction. 

    At the same time, be careful not to scratch the lens.


    5. The indoor environment can affect the lifespan of the machine, especially in damp and dusty conditions. 

    A damp environment is prone to causing rust on the reflective lenses and also easily leading to short circuits, discharge and sparking of the velvet laser.


  • What accidents might be caused by the laser emission when using a laser cutting machine?

    (1) A fire was caused by the laser coming into contact with flammable materials. 

    Everyone knows that the power of laser generators is very high, especially when it comes to high-power laser cutting machines, the temperature of the emitted laser is extremely high. The possibility of a fire being caused when a laser beam comes into contact with flammable objects is very high.

    (2) Harmful gases may be produced when the machine is in operation. 

    For instance, when cutting with oxygen, it undergoes a chemical reaction with the cutting material, generating unknown chemical substances or fine particles and other impurities. After being absorbed by the human body, it may cause allergic reactions or discomfort in the lungs and other respiratory tracts. Protective measures should be taken when conducting work.

    (3) Direct laser exposure to the human body can be harmful. 

    The damage caused by lasers to the human body mainly includes damage to the eyes and skin. Among the harms caused by lasers, the damage to the eyes is the most severe. Moreover, damage to the eyes is permanent. So when doing homework, you must pay attention to protecting your eyes.


  • What is the focused spot diameter of nanosecond, picosecond and femtosecond laser?

    Nanosecond: The light spot is 0.5-1mm.

    Picosecond: The focused spot is around 0.02mm.

    Femtosecond: Under the action of a laser beam with a high repetition rate of 100-200KHz and a very short pulse width of 10ps,

    the focused spot diameter is as small as 0.003mm.


  • What are the main applications of UV laser cutting machine?

    The UV laser cutting machine can be used for cutting and depaneling PCB. 

    It can precisely cut and shape various types of PCB circuit boards with V-CUT and stamp holes, and open Windows and covers. 

    It can also be used for separating packaged circuit boards and ordinary smooth boards. 

    It is suitable for cutting various types of PCB substrates, such as ceramic substrates, rigid-flex boards, FR4, PCBs, FPCs, fingerprint recognition modules, cover films, composite materials, copper substrates, aluminum substrates, etc.

  • Precautions for laser cutting machines to process various metal materials?

    Copper and brass: 

    Both materials have high reflectivity and excellent thermal conductivity. 

    Brass with a thickness of less than 1mm can be processed by nitrogen laser cutting. 

    Copper with a thickness of less than 2mm can be cut. The gas used for laser cutting processing must be oxygen. 

    Copper and brass can only be cut when a "reflective absorption" device is installed on the system. Otherwise, reflection will damage the optical components.


    Synthetic materials: 

    Processable synthetic materials include: thermoplastics, thermosetting materials and artificial rubber.


    Aluminum: 

    Despite its high reflectivity and thermal conductivity, aluminum materials with a thickness of less than 6mm can be cut, depending on the type of alloy and the capacity of the laser. 

    When cutting with oxygen, the cutting surface is rough and hard. 

    When nitrogen is used, the cutting surface is smooth. 

    Pure aluminum is extremely difficult to cut due to its high purity. 

    Only when a "reflection and absorption" device is installed on the fiber laser cutting machine system can aluminum materials be cut. 

    Otherwise, reflection will damage the optical components


  • What should be paid attention to when laser cutting stainless steel?

    Laser cutting processing of stainless steel requires the use of oxygen, under the condition that edge oxidation is not a concern. 

    If nitrogen is used to achieve an edge free of oxidation and burrs, no further processing is required. 

    Coating an oil film on the surface of the sheet will achieve a better perforation effect without reducing the processing quality.

 

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