Introduction to the application of CO2 laser cutting of ceramic substrates

As a flexible processing method, laser cutting has demonstrated extraordinary capabilities in ceramic substrate processing technology. 

The CO2 laser cutting machine has the following advantages for cutting ceramics:

• Good cutting quality,

• High efficiency,

• Smooth cutting surface without burrs,

• No contact between the cutting torch and the workpiece during processing,

•  no tool loss.

With the development of material technology, ceramic substrates have been increasingly used in industrial applications and scientific research applications due to their superior physical and chemical properties.

Whether it's precision electronics or in heavy industry such as aviation and shipping or our daily necessities, almost all fields have the application of ceramic substrates.

Although the ordinary mechanical method can also be processed, there will be stress during the processing due to the brittleness of the ceramic substrate, especially for those very thin ceramic pieces that are more likely to break.

Beyond Laser's ceramic substrate cutting equipment, uses high-quality CO2 lasers, cutting heads, and is equipped with precision linear motor cross tables, which not only ensures high precision, but also improves cutting efficiency and ensures the reliability and stability of cutting quality.