How does laser etching replace chemical etching in copper foil circuit boards?

Compared with similar processes, laser etching has obvious advantages.

The etching yield is high, the stability is high, and the flexibility is good. It can realize one-time molding technology with different graphics and angles, and it has no consumables, no pollution, and low cost. Circuit board materials have extremely high requirements for processing accuracy and technology, and the initial liquid etching has turned into today's laser etching market.

The difference between laser etching and chemical etching:

Laser etching is non-contact, highly flexible, fast processing speed, noiseless, and has a small heat-affected zone.

Picosecond laser cutting is paired with a comprehensive automation system to achieve high laser precision while saving energy, save time and cost, no manual operation required, more efficient.

Chemical etching is to use strong acid or strong alkali solution to directly chemically corrode the unprotected parts of the workpiece.

The etching depth can be deep or shallow, and the etching speed is very fast. The disadvantage is that the corrosive liquid greatly pollutes the environment and is difficult to recycle and cannot be used in production. The process is also harmful to the health of operators.

In recent years, with the advancement and stable development of automation control level and laser processing technology, it is an inevitable development trend for laser etching to replace liquid etching!