Domestic science and technology have progressed rapidly, and semiconductor chips have gradually been self-produced. Some areas have reached the world's advanced level.

Ultrashort pulses can process all kinds of materials without mechanical contact, and have the characteristics of high precision, repeatability and high production efficiency.

Laser marking can print various QR codes, text, scales, etc., and the character size can range from millimeters to microns!

It can be processed on single platform or on two platforms at the same time, with double production efficiency.

Laser etching is non-contact, highly flexible, fast processing speed, noiseless, and has a small heat-affected zone.

As a flexible processing method, laser cutting has demonstrated extraordinary capabilities in ceramic substrate processing technology.