It can be processed on single platform or on two platforms at the same time, with double production efficiency.

Laser etching is non-contact, highly flexible, fast processing speed, noiseless, and has a small heat-affected zone.

As a flexible processing method, laser cutting has demonstrated extraordinary capabilities in ceramic substrate processing technology. 

Laser technology provides a good solution for medical chips. The advantages of cutting chips include zero carbonization, no burrs, and small heat-affected areas.