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Six major applications of ultrafast lasers in precision processing in the consumer electronics industry
With the rapid development of the global consumer electronics industry, consumer electronic products are upgrading towards high integration and high precision.
The internal components of electronic products are becoming smaller and smaller, and the requirements for precision and electronic integration are getting higher and higher.
The development of laser advanced manufacturing technology has brought solutions to the precision processing needs of the electronics industry.
Taking the production process of mobile phones as an example, laser processing technology has penetrated into applications such as screen cutting, camera lens cutting, logo marking, and internal component welding.
At the "2019 Laser Advanced Manufacturing Technology Industry Application Seminar", scientific research and technical experts from Tsinghua University and the Shanghai Institute of Optics and Fine Mechanics of the Chinese Academy of Sciences conducted in-depth discussions on the current application of laser advanced manufacturing in the precision processing of consumer electronic products.
Below, Beyond Laser will analyze the six major applications of ultrafast lasers in precision processing in the consumer electronics industry:
1. Ultrafast laser ultra-fine special manufacturing:
Ultrafast laser micro-nano processing is an ultra-fine special manufacturing technology that can process special materials to achieve special structures and specific optical, electrical, mechanical and other properties.
Although this technology can no longer rely on materials to manufacture tools, it has broadened the types of processed materials and has the advantages of no wear and deformation.
At the same time, there are also problems in energy delivery and utilization efficiency, laser power and absorption wavelength selection, spatial accuracy of delivery, tool modeling, processing efficiency and accuracy that need to be solved and improved.
"Professor Sun Hongbo of Tsinghua University believes that laser manufacturing is still dominated by special tools, and macro and micro micro-nano manufacturing each have their own responsibilities.
In the future, ultrafast laser special fine manufacturing has great development potential in the direction of organic flexible electronics, space optical components and template transfer, quantum chips and nanorobots.
The future development direction of ultrafast laser manufacturing will be high-tech, high-added products, and strive to find industry breakthroughs".
2. Hundred-watt ultrafast fiber lasers and their applications:
In recent years, ultrafast fiber lasers have been widely used in consumer electronics, new energy, semiconductors, medical and other fields due to their unique processing effects.
Including the application of ultrafast fiber lasers in fine micro-processing fields such as flexible circuit boards, OLED displays, PCB boards, and mobile phone screen anisotropic cutting.
The ultrafast laser market is one of the fastest-growing markets in the existing laser field. It is estimated that the total ultrafast laser market will exceed US$2 billion by 2020.
The current mainstream in the market is ultrafast solid-state lasers, but as the pulse energy of ultrafast fiber lasers increases, the share of ultrafast fiber lasers will increase significantly.
The emergence of high-average power ultrafast fiber lasers greater than 150 W will accelerate the market expansion process of ultrafast lasers, and 1000 W, mJ-class femtosecond lasers will gradually enter the market.
3. Application of ultrafast laser in glass processing:
The development of 5G technology and the rapid growth of terminal demand have promoted the development of semiconductor devices and packaging technology, and put forward higher requirements for the efficiency and precision of glass processing.
Ultrafast laser processing technology can solve the above problems well and become a high-quality choice for glass processing in the 5G era.
4. Application of laser precision cutting in the electronics industry:
High-performance fiber lasers can perform high-speed and high-precision laser cutting, drilling and other laser micro-processing according to the design graphics of precision thin-walled metal equal-diameter tubes and special-shaped tubes, and can also perform small-scale precision plane cutting.
The latter is a high-speed, high-precision laser micro-processing equipment professionally used for precision flat thin-walled equipment.
It can process stainless steel, aluminum alloy, copper alloy, tungsten, molybdenum, lithium, magnesium-aluminum alloy, ceramics and other common flat materials used in the field of electronic equipment.
5. Application of ultrafast laser in full-screen special-shaped processing:
IPhoneX has opened up a new trend of full-screen special-shaped screens, and has also promoted the continuous progress and development of special-shaped screen cutting technology.
Zhu Jian, manager of the display and semiconductor division of Han's Laser, introduced the ICICLES non-diffraction beam technology independently developed by Han's Laser.
This technology adopts an original optical system to evenly distribute energy and ensure consistent quality of the cut section; it adopts an automated splitting solution; after the LCD screen is cut, there is no particle splashing on the surface, and it has the advantages of high cutting accuracy (<20 μm) and low thermal impact (<50 μm). This technology is suitable for sub-mirror processing, thin glass cutting, LCD screen drilling, automotive glass cutting and other fields.
6. Technology and application of laser printing conductive lines on the surface of ceramic materials:
Ceramic materials have many advantages such as high thermal conductivity, low dielectric constant, strong mechanical properties, good insulation properties, etc.
They have gradually developed into an ideal packaging substrate for a new generation of integrated circuits, semiconductor module circuits and power electronic modules.
Ceramic circuit board packaging technology has also received widespread attention and rapid development.
The existing ceramic circuit board manufacturing technology has the disadvantages of expensive equipment, long production cycle, and insufficient versatility of the substrate, which limits the development of related technologies and devices.
Therefore, the development of ceramic circuit board manufacturing technology and equipment with independent intellectual property rights is of great significance to improving my country's technical level and core competitiveness in the field of electronic manufacturing.
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What are the precautions for operating a laser marking machine?
1. It is strictly prohibited to start the laser power supply and Q-switching power supply when there is no water or the water circulation is abnormal.
2. The Q power supply is not allowed to operate without load (i.e., the output terminal of the Q power supply should be left floating).
3. In case of any abnormal phenomenon, first turn off the galvanometer switch and the key switch, and then conduct a check.
4. It is not allowed to start other components before the krypton lamp is lit to prevent high voltage from entering and damaging the components.
5. Pay attention to leaving the output terminal (anode) of the laser power supply suspended to prevent sparking and breakdown with other electrical appliances.
6. Keep the internal circulating water clean. Regularly clean the water tank and replace it with clean deionized water or pure water.
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What should we do when laser intensity decreases and the marking is not clear enough?
1. Turn off the machine and check if the laser resonant cavity has changed; Fine-tune the resonant cavity lens. Make the output light spot the best;
2. The acousto-optic crystal is offset or the output energy of the acousto-optic power supply is too low;
Adjust the position of the audio-visual crystal or increase the working current of the audio-visual power supply;
3. The laser entering the galvanometer deviates from the center: Adjust the laser;
4. If the current is adjusted to around 20A but the light sensitivity is still insufficient: the krypton lamp is aging. Replace it with a new one.
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How to maintain a UV laser cutting machine?
1. It is required to carry out regular cleaning every day, remove debris from the countertop, limiters and guide rails, and spray lubricating oil on the guide rails
2. The waste materials in the collection box should be cleared regularly to prevent excessive waste from blocking the exhaust port.
3. Clean the chiller once every 15 days, drain all the internal water, and then fill it with fresh pure water.
4. The reflector and focusing lens should be wiped with a special cleaning solution every 6 to 8 hours.
When wiping, use a cotton swab or cotton swab dipped in the cleaning solution to wipe from the center to the edge of the focusing lens in a counterclockwise direction.
At the same time, be careful not to scratch the lens.
5. The indoor environment can affect the lifespan of the machine, especially in damp and dusty conditions.
A damp environment is prone to causing rust on the reflective lenses and also easily leading to short circuits, discharge and sparking of the velvet laser.
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What accidents might be caused by the laser emission when using a laser cutting machine?
(1) A fire was caused by the laser coming into contact with flammable materials.
Everyone knows that the power of laser generators is very high, especially when it comes to high-power laser cutting machines, the temperature of the emitted laser is extremely high. The possibility of a fire being caused when a laser beam comes into contact with flammable objects is very high.
(2) Harmful gases may be produced when the machine is in operation.
For instance, when cutting with oxygen, it undergoes a chemical reaction with the cutting material, generating unknown chemical substances or fine particles and other impurities. After being absorbed by the human body, it may cause allergic reactions or discomfort in the lungs and other respiratory tracts. Protective measures should be taken when conducting work.
(3) Direct laser exposure to the human body can be harmful.
The damage caused by lasers to the human body mainly includes damage to the eyes and skin. Among the harms caused by lasers, the damage to the eyes is the most severe. Moreover, damage to the eyes is permanent. So when doing homework, you must pay attention to protecting your eyes.
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What is the focused spot diameter of nanosecond, picosecond and femtosecond laser?
Nanosecond: The light spot is 0.5-1mm.
Picosecond: The focused spot is around 0.02mm.
Femtosecond: Under the action of a laser beam with a high repetition rate of 100-200KHz and a very short pulse width of 10ps,
the focused spot diameter is as small as 0.003mm.
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What are the main applications of UV laser cutting machine?
The UV laser cutting machine can be used for cutting and depaneling PCB.
It can precisely cut and shape various types of PCB circuit boards with V-CUT and stamp holes, and open Windows and covers.
It can also be used for separating packaged circuit boards and ordinary smooth boards.
It is suitable for cutting various types of PCB substrates, such as ceramic substrates, rigid-flex boards, FR4, PCBs, FPCs, fingerprint recognition modules, cover films, composite materials, copper substrates, aluminum substrates, etc.
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Precautions for laser cutting machines to process various metal materials?
Copper and brass:
Both materials have high reflectivity and excellent thermal conductivity.
Brass with a thickness of less than 1mm can be processed by nitrogen laser cutting.
Copper with a thickness of less than 2mm can be cut. The gas used for laser cutting processing must be oxygen.
Copper and brass can only be cut when a "reflective absorption" device is installed on the system. Otherwise, reflection will damage the optical components.
Synthetic materials:
Processable synthetic materials include: thermoplastics, thermosetting materials and artificial rubber.
Aluminum:
Despite its high reflectivity and thermal conductivity, aluminum materials with a thickness of less than 6mm can be cut, depending on the type of alloy and the capacity of the laser.
When cutting with oxygen, the cutting surface is rough and hard.
When nitrogen is used, the cutting surface is smooth.
Pure aluminum is extremely difficult to cut due to its high purity.
Only when a "reflection and absorption" device is installed on the fiber laser cutting machine system can aluminum materials be cut.
Otherwise, reflection will damage the optical components
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What should be paid attention to when laser cutting stainless steel?
Laser cutting processing of stainless steel requires the use of oxygen, under the condition that edge oxidation is not a concern.
If nitrogen is used to achieve an edge free of oxidation and burrs, no further processing is required.
Coating an oil film on the surface of the sheet will achieve a better perforation effect without reducing the processing quality.